The 2022 5th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2022) [第五届先进电子材料、计算机与软件工程国际学术会议（AEMCSE 2022）]will be held in Wuhan, China during April 22-24, 2022.
AEMCSE is an annual conference which explores the development and implications in the related fields of Advanced Electronic Materials, Computers and Software Engineering with an objective to present the novel and fundamental advancements. It also serves to foster communication among researchers and practitioners working in a wide variety of scientific areas with a common interest in improving Advanced Electronic Materials, Computers and Software Engineering. Featured with invited speeches and paper presentations, AEMCSE 2022 welcomes submission of researches concerning any branch of Advanced Electronic Materials, Computers and Software Engineering. Sincerely invite you to attend the conference.
Notice: Dear scholars, given the pandemic of Covid-19 in various areas in China, the Organizing Committee has carefully decided to hold the conference online. We sincerely apologize for any inconvenience caused to you. |
Official Chinese website：https://www.ais.cn/attendees/index/JQQEZ3
AEMCSE 2022 has been officially approved by IEEE!
Submission Deadline: March 31, 2022 April 13, 2022（All day） Registration Deadline: April 22, 2022 Conference Date: April 22-24, 2022
 AEMCSE Overview(检索记录) | ||
AEMCSE 2021: Online | March 26-28 | AEMCSE 2021 proceedings: IEEE Xplore | EI Compendex Scopus Index |
AEMCSE 2020: Shenzhen | April 24-26 | AEMCSE 2020 proceedings: IEEE Xplore | EI Compendex Scopus Index |
AEMCME 2019: Changsha | April 19-21 | IOP Conference Series: MSE,Volume 563 | EI Compendex Scopus Index |
AEMCME 2018: Singapore | Sept. 14-16 | IOP Conference Series: MSE, Volume 439 | EI Compendex Scopus Index |
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of AEMCSE 2022 will be published in the IEEE CPS (Conference Publishing Services), which will be submitted to IEEE Xplore, EI Compendex, Scopus for indexing. | |
◆ EI Template Download： Template | ◆ Submission Methods: SUBMISSION SYSTEM |
| Call For Paper | ||
| Computers Engineering | 计算机工程 | Software Engineering | 软件工程 | Advanced Electronic Materials | 先进电子材料 |
▪Operating Systems ▪Quantum Computing Theory ▪Scientific Computing ▪Computer Programming ▪Database Management Systems ▪Evolutionary Computation ▪Logic Programming ▪Machine Learning ▪Software Engineering ▪Symbolic Mathematics ▪Digital Signal Processing (DSP) ▪Advanced Adaptive Signal Processing ▪Computer Vision & VR ▪Multimedia & Human-computer Interaction ▪AI & Neural Networks ▪Communication Signal processing ▪SP for Internet and Wireless Communications * Other related topics.. | ▪Software Architecture ▪Software design method ▪Software testing technology ▪Automated software design and synthesis ▪Component-based software engineering ▪Computer-supported collaborative work ▪Programming language and software engineering ▪Computer network ▪Information and communication security ▪Multimedia technology application ▪Artificial intelligence and recognition ▪Embedded software and applications ▪Automatic control ▪Cloud computing technology ▪Storage technology ▪Big data analysis and processing * Other related topics.. | ▪Dielectric material ▪Semiconductor material ▪Piezoelectric and ferroelectric materials ▪Conductive metals and their alloys ▪Magnetic material ▪Optoelectronic materials ▪Electromagnetic shielding materials * Other related topics.. |
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